BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11

$52.82

+ Free Shipping

Availability: 100 in stock

SKU: TBD04266910 Category:
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1. Fast and stable, precise positioning
2. High temperature resistant material, not easy to deform, no bulge, no virtual welding.
3. Assist professionals to carry out BGA tin planting in a convenient and safe way.
4. For iPhone A11
5. The strength is more durable and not deformed
6. Dimensions: 85 x 85 x 15mm
7. Weight: 376 grams

Specification:
General
Compatible with
Apple: iPhone 11
Package Weight
One Package Weight 0.40kgs / 0.89lb
One Package Size 5cm * 3cm * 4cm / 1.97inch * 1.18inch * 1.57inch
Qty per Carton 74
Carton Weight 30.00kgs / 66.14lb
Carton Size 20cm * 12cm * 16cm / 7.87inch * 4.72inch * 6.3inch
Loading Container 20GP: 6944 cartons * 74 pcs = 513856 pcs
40HQ: 16121 cartons * 74 pcs = 1192954 pcs

Weight 0.404 lbs
Dimensions 5 × 3 × 4 in

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BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11
$52.82

Availability: 100 in stock