1. The blade is made of special steel, laser cutting, manual polishing, moderate hardness, flexibility, comfortable feel, hardness, and toughness
2. Separation of dot matrix, glue removal from the bottom of the board, wire break assistance, removal of large chips
3. It is suitable for separating dot-matrix/board bottom glue removal/large chip removal/disconnection assistance, etc., to meet your maintenance needs
4. The blade is hardened, the cutting edge is ultra-thin, the slope on both sides is polished at the same time, and the blade is evenly stressed on both sides from thick to thin
5. Super toughness, better protection of mobile phone chips
6. With a universal handle, high-quality material selection, and a strong guarantee of product quality
7. Mobile phone repair commonly used blades, hard disk removal, removal of mobile phone chips, motherboard CPU layering
Specification:
| Package Weight |
| One Package Weight |
0.07kgs / 0.15lb |
| One Package Size |
15cm * 10cm * 3cm / 5.91inch * 3.94inch * 1.18inch |
| Carton Weight |
6.30kgs / 13.89lb |
| Carton Size |
52cm * 32cm * 32cm / 20.47inch * 12.6inch * 12.6inch |
| Loading Container |
20GP: 500 cartons * 100 pcs = 50000 pcs
40HQ: 1162 cartons * 100 pcs = 116200 pcs |
|
Reviews
There are no reviews yet.